![]() The vapor phase soldering process achieves perfect results on a wide range of assemblies, from flexible to multi-layer substrates, reliably without overheating. As the RDPR profile goes from the soak temperature of 140 to 160☌, it shoots straight up to the peak reflow temperature. Irrespective of the time the solder material remains in the vapor, its temperature can never exceed the defined maximum vapor temperature.Īs a result, the solder process can be reliably reproduced and offers ideal pre-conditions for a reliable and repeatable process control. Solder reflow is accomplished in the reflow zone, where the solder paste is elevated to a temperature greater than the melting solder point. As soon as the solder material is immersed into the vapor zone, the vapor condenses on the solder material and transfers its heat. Industry terminology, coupled with our unique form of process parameter verification. It has been designed to be user-friendly for both temperature profiling novices and experts alike. The vapor’s weight is greater than the surrounding air and forms a protective gas atmosphere (0 ppm oxygen) without the need for any additional gases, such as nitrogen. At the heart of all Solderstar’s profiling solutions lies the powerful and intuitive Profile Central Software suite, regarded by many as the best available. The systems are batch vacuum furnaces for solder reflow using formic acid, H2-Hydrogen, Forming gas snd N2 controlled atmophere for various soldering processes, including flux less, eutectice die attach, void free soldering, hermetic lid sealing and flip chip soldering etc. ![]() ProcessĪs soon as the fluid starts to evaporate, a layer of saturated vapor and condensing fluid covers the soldering area creating an inert (oxygen-free) atmosphere. Vacuum Solder Reflow Ovens by ATV for void-free soldering. The boiling point is very accurate depending on the application, most fluids have boiling points between 165☌ up to 260☌. This fluid is non-corrosive, electrically non-conductive and does not deteriorate over time. Basic configurationĪ chemically inert fluid is used for the heat transfer. ![]() It allows processing of all components without elaborate setup and without temperature profiling. ![]() Solder paste comes in many varieties with the solder type, shape. It can be processed at the same speed as epoxy die attach, yet provides the high thermal conductivity needed for the components to function correctly. It is ideally suited for all types of SMT components and base materials. Solder paste die attach or reflow attach uses solder paste to attach SMT components. However, for greater process accuracy, higher quality solder joints, consistently repeatable heating, and lower reflow costs, vapor phase soldering (also known as condensation soldering or vapor phase reflow), is the most flexible, simplest and most reliable reflow soldering method. The best soldering method achieving gentle heating and optimum qualityĪll soldering processes have one thing in common: they are able to securely attach components onto specified base material. ![]()
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